AI's next bottleneck: Why even the best chips made in the U.S. take a round trip to Taiwan

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI..

• In this article An underappreciated step in the chipmaking process is poised to become the next bottleneck forartificial intelligence
• Every microchip used to power artificial intelligence must be put into hardware that can interact with the outside world
• But right now, almost all of this chipmaking step, known as advanced packaging, happens in Asia, and capacity is in short supply