Mitsui & Co. and Kaynes Technology have announced a joint venture to construct a $280 million outsourced semiconductor assembly and test (OSAT) facility in Tamil Nadu, India. The project aims to expand global semiconductor manufacturing capacity amid ongoing supply chain diversification efforts.
- Mitsui & Co. and Kaynes Technology are co-investing $280 million in a new OSAT facility in Tamil Nadu, India.
- The plant is set to begin operations in late 2027 with a target capacity of 120,000 wafers per month by Year 3.
- It will specialize in advanced packaging technologies, including 2.5D and 3D IC packages for AI and automotive sectors.
- The project is eligible for India’s PLI scheme, reinforcing government incentives for semiconductor infrastructure.
- The facility is expected to support clients of major semiconductor firms, including NVIDIA (NVDA), TSMC, and SMIC.
- The development is part of broader efforts to diversify global semiconductor manufacturing beyond East Asia.
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